Declining birthrates have become a serious social issue in countries such as Japan and across Europe and North America. As demand for fertility treatment continues to rise^*, embryologists supporting assisted reproductive technologies (including in vitro fertilization (IVF), intracytoplasmic sperm injection (ICSI), and clinical embryology) face an increasing workload. Against this societal backdrop, Nikon Solutions Co., Ltd., a subsidiary of Nikon, released the ECLIPSE Ti2-I, a microscope designed specifically for ICSI, in July 2024.
ICSI involves injecting a single sperm directly into an egg under a microscope, requiring highly accurate work within a limited time. The ECLIPSE Ti2-I enables users to switch microscope settings and observation modes for each process with a single touch of a button while maintaining focus through the eyepiece, reducing approximately 75% of the steps required for microscope operation compared to ordinary models (based on Nikon research). In addition, the display features intuitive icons and an alert function to prevent operational errors. Further, the microscope leverages Nikon optical technologies to provide full-color, omnidirectional visualization of the oocyte spindle, which is difficult to see even under a microscope. This feature helps embryologists accurately determine the angle to insert the needle when injecting the sperm.

With the miniaturization of circuit patterns in monolithic ICs approaching its practical limits, chiplet technology is gaining attention as a new semiconductor manufacturing technology. Large chiplets are particularly critical for data center semiconductors, which must house multiple chips. This trend increases demand for interconnect exposure systems that enable precise wiring between chips, requiring both finer resolution and larger exposure areas.
Our high-resolution semiconductor lithography system technology, developed over many years, enables miniaturization. We are also developing digital lithography systems tailored to advanced interconnect formation. We also address the challenge of expanding exposure area by applying multi-lens technology from FPD lithography systems, which efficiently scan wide exposure fields using an array of lenses. Our systems provide an indispensable technological foundation for next-generation semiconductor manufacturing by balancing miniaturization with productivity.