Products

The NSR-S610C is the world's first ArF immersion scanner to achieve NA of 1.30. The equipment ensures enhanced alignment accuracy and high throughput thanks to Nikon's original tandem stage design and local fill nozzle that constitutes one of the essential elements in immersion lithography technology while eliminating possible defects due to immersion even in the top-coatless resist approach. This machine accommodates volume production of the most advanced devices with resolutions of 40 to 45 nm and already has a proven track record of producing results in our customers' production lines.

• Product

The NSR-S310F ArF scanner incorporates the tandem stage already proven in the practical application of immersion lithography technology to further enhance throughput and alignment accuracy, and improve productivity by 20% over conventional models. Also it employs the high-performance projection optics offering an ultra-high NA of 0.92 to suit volume production of devices with resolution of 65 nm or less and greatly reduce CoO (Cost of Ownership).

• Product

The NSR-S210D KrF scanner features the high-performance projection optics offering NA of 0.82 to accommodate volume production of devices with resolution of 110 nm or less. It incorporates the tandem stage already proven in the practical application in the immersion lithography equipment to ensure higher throughput and greater alignment accuracy, providing improved productivity by 20% over conventional models.

• Product

The NSR-SF155 is an i-line all-in-one scan field stepper designed with an innovative platform best suited for steppers, Skyhook Technology and light-weight wafer stage to achieve substantially reduced vibration and fastest possible stage movement. The equipment boasts of an ultra-high throughput of 200 or more wafers per hour (for ø300 mm wafers). This system also provides the flexibility of being able to upgrade from SF150 to SF155 in our customers' production lines.

• Product

The WES-3000 is a wafer edge inspection tool offering high-throughput and consistent in-line inspection of wafer edges.
The WES-3000 has the ability to review the inspection results and any edge defects detection through high-definition and high-resolution color images. Additionally, Nikon's accumulated proprietary optical technologies enable the WES-3000 to achieve 1um - resolution for defect review. For optimizing and improving process, a variety of application software enables you to reduce huge time and work.

The APM is configured with the PER (Pattern Edge Roughness) optical system achieved in the practical application with AMI (Automatic Macro Inspection System).
The APM offers wide coverage area and high sensitivity comparable to that of SEM (scanning electron microscope),for optimizing and improving process, a variety of application software enables you to reduce huge time and work.

NWL200 series is designed with Nikon's proprietary wafer transfer mode for wafers of 125 to 200 mm in size. The single-piece equipment allows transfer of three different sizes of wafers (optional). This series offers the capability of inspecting ultra low-profile wafers of 100 micrometers in thickness to meet the market needs (optional). It is also equipped with the capability to inspect edge chipping and wafer edge defects after back grinding which have become challenges to be solved in the production processes in the trend toward increasingly finer design rules.

BW-H501 features high-speed measurement of surface profiles based on the omnifocal camera system and Nikon Instech's newly developed fringe cycle method software. The equipment allows high-speed and high-precision three-dimensional (3D) inspection in 200 ms for a height of 40μm.