Wafer Carrier Measuring System NEXIV VMR-C4540

Non-contact, fully automatic measurement provides outstanding throughput. Perfect for measuring FOUP and FOSB.

Four side planes of the carrier are continuously measured by rotating the kinematic plate in 90° increments
SEMI-compliant kinematic plate provides perfect XYZ coordinates
Variety of illumination choices facilitate accurate measurements of registration pin holes and latch-key holes
Laser AF provides fast, non-contact measurements of wafer positions
Wide area, high-intensity LED illumination enables accurate measurements of wafer heights
300mm, 200mm wafer carrier and SMIF Pod base

Compatible carriers (FOUP, FOSB, OC)		SEMI-compliant ø300mm wafer carriers 200mm wafer carriers (with dedicated adapter)
Stroke	Measuring head (X x Y x Z)	480 x 180 x 400 mm (18.9 x 7.1 x 15.7 in.)
	Rotary table	360° (in 90° increments)
Minimum readout		0.1µm
Head travel speed		XZ axis: max. 200mm/s (7.9 in.) Y axis: max. 50mm/s (2.0 in.)
Kinematic plate rotation speed		90°/2 sec.
Camera		B&W 1/2-in. CCD
Optical magnification		0.27X to 2.74X (5-step 10X zoom)
Field of view		20 x 16 mm to 2.0 x 1.6 mm
Max. workpiece weight		15kg (33.1 lb.)
Measuring accuracy		(10 + 10L/1000)µm, L = measuring length in mm
Repeatability (2σ)		2µm
Illumination		Episcopic, diascopic, darkfield
Auto focus		Laser AF, Vision AF
Power source		AC100-240V±10%, 50/60Hz
Power consumption (approx.)		AC100-120V: 13A (main unit), 9A (PC) AC200-240V: 7A (main unit), 5A (PC)
Dimensions		1400 (W) x 1739 (D) x 2530 (H) mm (55.1 x 68.5 x 99.6 in.)
Weight		Approx. 1400kg (3086.41 lb.)
Host computer		IBM PC/AT (Windows^® XP)
Monitor		19-in. TFT