Ultra-large Stroke Type with Maximum Magnification Module NEXIV VMR-10080 Z120X

LCD glass substrates (pattern measurements)
Organic EL glass substrates (pattern measurements)

• Automatic measurements of small parts by placing multiple pieces together on the stage
• Laser AF achieves high-accuracy measurements of bump heights
• Laser AF also enables measurements of height gaps and warping in workpieces
• Search function enables measurements of lands and holes of PCBs
• Search function also provides accurate measurements even when workpieces are not located properly on the stage
• Variety of illumination choices facilitate accurate edge detection even for vague geometries
• High-speed stage and high-speed image processing provide high throughput

High-density PCB	LCD
Photo mask	CCD

Stroke (XxYxZ)
	With high magnification lens	1000 x 800 x 150 mm (39.4 x 31.5 x 5.9 in.)
	With low magnification lens	950 x 800 x 150 mm (37.4 x 31.5 x 5.9 in.)
Minimum readout		0.1µm
Maximum workpiece weight		40kg (88.2 lb)
Measuring accuracy
	U1X, U1Y	2 + 4L/1000µm (with a workpiece max. 40kg)
	U2XY	3 + 4L/1000µm (with a workpiece max. 40kg)
Z-axis (L: Length in mm < W.D.)		11.5 + L/150µm
Camera		B&W 1/3-in. CCD (progressive scan), color 1/3-in. CCD
Working distance		High mag. objective lens: 9.8mm Low mag. objective lens: 32mm
Magnification vs field of view		1 - 120X / 4.67 x 3.5 - 0.039 x 0.029 mm
Auto focus		TTL Laser AF and Vision AF
Illumination		Episcopic, diascopic (with high mag. head only), darkfield illumination
Power source		AC100-240V±10%, 50/60Hz
Power consumption		Max. 15A
Dimensions & weight
	Main unit & table	1530 (W) x 2200 (D) 1750 (H) mm, approx. 1500kg (60.2 x 86.6 x 68.9 in., 3306.9 lb.)
	Controller	250 (D) x 550 (D) x 500 (H) mm, approx. 31kg (9.8 x 21.7 x 19.7 in., 68.3 lb.)
Footprint		2800 (W) x 2500 (D) mm (110.2 x 98.4 in.)
Host Computer
Main unit		IBM PC/AT (Windows® XP)
Monitor		20-in. TFT color

*The "Z120X" type is equivalent to the "TZ" type in Japan.