Lineup
Semiconductors control a host of functions in electronic equipment. Nikon offers a stellar lineup of cutting-edge lithography systems that support precision circuit design down to the nanometer level.
- Front-end Lithography Systems
- Back-end Lithography Systems (Advanced Packaging)
- Alignment Stations
- Metrology/Inspection Systems
Front-end Lithography Systems
ArF Immersion Scanners
NSR-S636E
Performance
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| Resolution | ≦ 38 nm |
|---|---|
| NA | 1.35 |
| Exposure light source | ArF excimer laser (193 nm wavelength) |
| Reduction ratio | 1:4 |
| Maximum exposure field | 26 mm × 33 mm |
| Overlay | ≦ 2.1 nm (MMO*1) |
| Throughput | ≧ 280 wafers/hour (96 shots) |
- *1Mix and Match Overlay: machine-to-machine overlay accuracy (NSR-S636E#1 to S636E#2)
NSR-S635E
Performance
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| Resolution | ≦ 38 nm |
|---|---|
| NA | 1.35 |
| Exposure light source | ArF excimer laser (193 nm wavelength) |
| Reduction ratio | 1:4 |
| Maximum exposure field | 26 mm × 33 mm |
| Overlay | ≦ 2.1 nm (MMO*1) |
| Throughput | ≧ 275 wafers/hour (96 shots) |
- *1Mix and Match Overlay: machine-to-machine overlay accuracy (NSR-S635E#1 to S635E#2)
NSR-S625E
Performance
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| Resolution | ≦ 38 nm |
|---|---|
| NA | 1.35 |
| Exposure light source | ArF excimer laser (193 nm wavelength) |
| Reduction ratio | 1:4 |
| Maximum exposure field | 26 mm × 33 mm |
| Overlay | ≦ 2.5 nm (MMO*1) |
| Throughput | ≧ 280 wafers/hour (96 shots) |
- *1Mix and Match Overlay: machine-to-machine overlay accuracy (NSR-S625E#1 to S625E#2)
ArF Scanners
NSR-S322F
Performance
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| Resolution | ≦ 65 nm |
|---|---|
| NA | 0.92 |
| Exposure light source | ArF excimer laser (193 nm wavelength) |
| Reduction ratio | 1:4 |
| Maximum exposure field | 26 mm × 33 mm |
| Overlay | ≦ 5 nm (MMO*1) |
| Throughput | ≧ 230 wafers/hour (96 shots), ≧ 250 wafers/hour (96 shots)*2 |
- *1Mix and Match Overlay: machine-to-machine overlay accuracy (NSR-S322F#1 to S322F#2)
- *2When option is applied
KrF Scanners
NSR-S220D
Performance
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| Resolution | ≦ 110 nm |
|---|---|
| NA | 0.82 |
| Exposure light source | KrF excimer laser (248 nm wavelength) |
| Reduction ratio | 1:4 |
| Maximum exposure field | 26 mm × 33 mm |
| Overlay | ≦ 6 nm (MMO*1) |
| Throughput | ≧ 230 wafers/hour (96 shots) |
- *1Mix and Match Overlay: machine-to-machine overlay accuracy (NSR-S220D#1 to S220D#2)
i-line Steppers
NSR-SF155
Performance
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| Resolution | ≦ 280 nm |
|---|---|
| NA | 0.62 |
| Exposure light source | i-line (365 nm wavelength) |
| Reduction ratio | 1:4 |
| Exposure field | 26 mm × 33 mm |
| Overlay | ≦ 25 nm (SMO*1) |
| Throughput | ≧ 200 wafers/hour (300 mm wafer, 76 shots), compatible with 200 mm wafer |
- *1Single Machine Overlay: machine-to-self overlay accuracy
5x Reduction i-line Stepper
NSR-2205iL1
Performance
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| Resolution | ≦ 350 nm*1 |
|---|---|
| NA | 0.45 |
| Exposure light source | i-line (365 nm wavelength) |
| Reduction ratio | 1:5 |
| Maximum exposure field | 22 mm × 22 mm |
| Overlay | ≦ 70 nm*1 (SMO*2) |
- *1When option is applied
- *2Single Machine Overlay: machine-to-self overlay accuracy
Back-end Lithography Systems (Advanced Packaging)
Digital Lithography System DSP-100
Performance
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| Resolution | 1.0 µm L/S |
|---|---|
| Exposure light source | Equivalent to i-line |
| Overlay | ≦ ± 0.3 µm |
| Supported substrate size*1 | Square substrate: up to 600 × 600 mm |
| Throughput | 50 panels/hour (with 510 × 515 mm substrate) |
- *1Compatible with wafers and even larger substrates
Alignment Stations
Litho Booster
Litho Booster is an advanced Alignment Station that leverages proprietary Nikon technologies developed for semiconductor lithography systems. Absolute grid distortion values are measured quickly with ultra-high precision for all wafers prior to exposure. Correction values are then fed forward to the lithography system to greatly improve overlay accuracy without reducing throughput, contributing to enhanced yield and optimized equipment investments.
Metrology/Inspection Systems
Automatic Macro Inspection System AMI-5700
The AMI-5700 makes both high throughput and exceptional detection sensitivity very achievable. The aim of this device is to realize higher sensitivity and accuracy than previous models. It achieves high-speed measurement and inspection by performing batch imaging of the entire wafer surface. This is an innovative device that can perform inspection and measurement as a single unit.
Wafer Inspection System OPTISTATION-3200/3100/3000
The OPTISTATION is a wafer inspection system that enables simple and speedy manual visual inspection of 300 mm wafers. It contributes to dramatic increases in yields as an inline inspection system and analysis tool for R&D defect analysis.
Illumination System for Image Sensor Inspection N-SIS9/8
The N-SIS9/8 is an illumination system specialized for image sensor inspection. The system provides high-power, highly uniform illumination over a large inspection field, enabling high-speed illuminance setting and high-speed spectral settings including RGB.
All of the products on this page are under export restriction. The export of these products is controlled by Japanese Foreign Exchange and Foreign Trade Law and International export control regimes. They shall not be exported without authorization from the appropriate governmental authorities. (Excluding semiconductor inspection equipment)