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Glossary


A

Aberration

The ideal optical imaging resolution must fulfill three conditions:

  1. Light emitting from a single point on the object must resolve to a single point in the image (convergence),
  2. When the object is a plane perpendicular to the optical axis, the image must also be a plane perpendicular to the light beam, and
  3. The shapes of object and image must be identical.

In reality, however, defects in the resolved image occur, due to the laws of refraction acting on the lens. These are called aberrations.
There are five common types of aberration occurring with monochromatic (single-wavelength) light, called Seidel's five aberrations, and two types of color aberration occurring with polychromatic (two or more wavelengths) light.
While it is impossible to completely eliminate aberration, the optical glass composition, shape and positioning of the lenses is optimized for the specific application during design to provide a good balance of the seven types.
For details, refer to the glossary for "Nikkor - The Thousand and One Nights."

Amorphous

Solid materials crystallized with no specific atomic arrangements. This occurs when this layers are formed in a vacuum from vaporized materials as well as when materials are rapidly cooled down from melting state.

Angle structure

Structure constructed in such a way that numerous "L" shapes are formed in its cross section.

ArF excimer laser

With a wavelength of 193nm, this type of laser gets its name from the inert gases used for discharge excitation: a mixture of argon (Ar) and fluorine (F) halogen.

Aspect ratio

The ratio between the width and height of the rectangular.

Aspherical lens

These lenses do not have spherical curvatures.

B

Bimorph

Composed of two thin films with different mechanical characteristics layered together.

Blazed grating

A special type of diffraction grating, where the grooves are triangular to boost the diffraction efficiency of particular orders of light.

C

Cantilever

A long, thin horizontal structure with only one end anchored.

CCD(Charge Coupled Device)

Type semiconductor device is often referred to as the "eye of electronics," and functions to convert optical signals (light) into electrical signals. It is used not only in digital still cameras and camcorders, but also in the camera mobile phones becoming so popular in recent years.

Chamber

A long, thin horizontal structure with only one end anchored.

CVD (Chemical Vapor Deposition)

Chemical vapor deposition.
A process for forming thin solid film by chemical reaction among vapor.

D

Detector

A device for passive sensing of information.

Diffraction grating

A device formed on a substrate with a regular structure, which diffracts light.

E

Electric field

An electric field is the set of lines of force that act on charged particles. A light wave will impose an oscillating force on a charged particle. Because atoms are made of charged particles, the electric field controls the way in which light is absorbed and emitted.

Excimer laser

An excimer (a contraction of EXCIted dimMER) laser is a gas laser used as high-output, high-efficiency pulsed laser light source in the visible short-wavelength, ultraviolet or deep ultraviolet spectra.
Closed-shell atoms of inert gases, which do not form stable molecules in the base state, are excited by discharge to form strong bonds with other stable-state atoms, creating a diatomic molecule. Excimer lasers utilize the transition between this excimer state and the ground state for laser oscillation.

Exposure system

A system for optically transferring a pattern from an original (mask, reticle, film, etc.) to a sample, or projecting the pattern onto it.
A common application is in enlargers which project images from positive or negative film onto photographic printing paper to make enlargements.

F

Field Emission Display

FED technology is similar in operation to CRTs in that fluorescent screen is excited by a stream of electrons traveling through a vacuum. The FED, however, is matrix-addressed, one entire row at a time with millions of electron-emitting cathodes. These emitters are a fraction of a millimeter (or up to 5 mm in the case of high-voltage FEDs) away from the fluorescent screen, and they are produced by cold cathode emission.

Fullerene

The collective term for a recently discovered third type of carbon allotrope, following graphite and diamond. Fullerenes consist entirely of 60 or more carbon atoms in a tight spherical or tubular cage-like structure. One example is C60, a soccer ball-shaped molecule approx. 0.7 nanometer in diameter.

H

Harmonic

A sinusoidal wave that is an integral multiple (2 or more) of the frequency of a fundamental wave.

K

KrF excimer laser

With a wavelength of 248nm, this type of laser gets its name from the inert gases used for discharge excitation: a mixture of krypton (Kr) and fluorine (F) halogen.

L

Line sensor

A device comprised of a row of light-sensitive elements, which convert light into electrical signals to measure the cumulative amount.

Lithography

Originally a technology of printing with stone plates, today it is used to indicate printing resist patterns on silicon or other substrates.

LSI (Large Scale Integration)

Integrated Circuit (IC) is a high-density structured device featuring wired transistors and resistances on a silicon substrate using lithography and impurity-diffusion technologies. A single IC contains anywhere from a few electronic circuits to millions, and depending on the number of circuits, IC should be described as LSI (Large Scale Integration) or VLSI (Very Large Scale Integration).

M

Microgripper

A device used to manipulate specimens under a microscope. Using a thin-film finger measuring 0.7μm in thickness and 600μm in length, microgrippers can handle or measure the solidity of eggs or protozoa sized from 20 — 100μm. Microgrippers are also fully operable even when immersed in liquid.


Microknife

Microknife

Conventional steel knife


Constructed of thin film as microgrippers, the microknife offers outstanding cutting capability. It is used for cutting specimens under a microscope.


Micrometer (μm)

One millionth of a meter.
1,000 nanometers.

N

Nyquist frequency

This frequency is exactly half of the sampling frequency. Any frequency above this threshold is, in theory, impossible to reproduce.

Nanometer (nm)

One billionth of a meter (10-9 meters).
One millionth of a mm.
One 1,000th of a micrometer.
The root 'nano' means one billionth.

Non-linear Optics

The phenomenon that the amplitude of the output light is not proportional to the amplitude of incidence light. Products of this phenomenon include frequency conversion which causes the generation of harmonics, and changes to the refractive index of light based on a change in its power.

O

Oxygen plasma processing

Chemical-reaction processing using an oxygen radical which is formed within plasma.

P

Pentaprism

Abbreviation for pentagonal roof prism.
This prism has a pentagonal cross-section, and is an optical component used in SLR cameras. Light is fully reflected three times, so that the image displayed in the viewfinder is oriented correctly.

Phase-shift method

An amount of transparent material is formed above the mask or reticle, and its phase shifted to increase contrast of the pattern resolved on the wafer. This optical lithography method improves resolution.

Plasma

As temperature rises, most materials change from solid, to liquid, to gas. At even higher temperatures, gas molecules break apart into atoms, and eventually the electrons orbiting the atomic nuclei are spun off.
This phenomenon is called disassociation. When a gas has roughly equivalent densities of positively and negatively charged particles formed in this way, maintaining electrical neutrality, it is called a plasma.
Some plasmas existing in nature are the sun, the aurora and lightning.
Manmade plasmas are widely used in illumination (fluorescent and neon lighting) and fabrication (welding and etching).

Polarized light

Light with a condition in which the direction of vibration of light wave is uniform.

Polymer

A molecule composed of a large number of atoms, with a molecular weight over about 10,000.

Probe

A needle, electrode, sensor or other element used to measure something, whether contact or non-contact.

R

Resist

A material which is photosensitive to light, electron beams or other specific forms or radiation.
One of the most common applications is as emulsion used in photographic film.

Reticle

The reticle is a photomask marked with the actual circuit pattern, which is projected onto the wafer by a stepper or other projection optics.

S

S/N ratio

The ratio between the amplitude of the signal (S) to be received and the amplitude of the unwanted noise (N) at a given point in a receiving system.

Scanner

Usually this refers to a device, such as a film scanner or a flatbed scanner, which scans an image for input.
A type of stepper, the lens-scanning stepper used for exposure, is also called a scanner.

Sensor

A device to actively or passively detect information.

SHRINC: Super High Resolution by IllumiNation Control

Generally referred to as oblique illumination.
Traditionally, light in lithographic systems was perpendicular to the reticle, but this technology shines light at an angle to increase resolution and improve focal depth.

Stepper: step-and-repeat exposure system

"Stepper" is the general name given to step-and-repeat exposure systems.
Unlike exposure systems such as contact mask aligners, proximity mask aligners or mirror projection mask aligners, the wafer or other substrate is placed on a stage, which is moved precisely (in steps) while the system repeats the exposure process.
Lens-scanning steppers are generally referred to as scanners.

T

Thermal CVD (Thermal Chemical Vapor Deposition)

CVD which is conducted under the thermodynamically-balanced environment by simple heating without assist such as plasma, ion, light and laser.

V

Vacuum deposition

Metals and other materials are heated to evaporation in a vacuum, and then deposited on resin, glass or other surfaces as extremely thin films.

W

Wafer

Named for their cookie-like shapes, wafers are actually thinly sliced polished discs of materials like silicon (Si), gallium arsenide (GaAs), gallium phosphide (GaP) or gallium nitride (GaN) and artificial diamond. They are the substrates for semiconductor devices.

Y

Yoshida Nanomechanism Project

Founded in October 1985 as one of the creative science promotion projects sponsored by the Japan Science and Technology Corporation, under Shoichiro Yoshida. It continued until 1990, investigating methods for measuring, controlling and fabricating objects on a nanometer (10-9) order, and developing equipment to implement them. It achieved 12 major research results, including:

  • Achieved positioning precise to one nanometer
  • Developed a measurement method eliminating the effects of atmospheric waver, using a dual-wavelength laser interferometer
  • Developed an X-ray reflective multi-layer film with top-class performance
  • Prototyped a composite SEM/STM (scanning electron microscope/scanning tunneling microscope) system to analyze the states of fabricated surfaces
  • Fabrication of an ultra-smooth surface using an ion beam to reduce surface roughness to 0.1 nanometer

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